As semiconductor process nodes shrink to 3nm, 2nm, and beyond, feature sizes and 3D architectures grow exponentially complex—turning even sub-10nm particles into yield-killers. In advanced manufacturing, a single contaminant in cooling fluids, photoresists, or etchants can disrupt circuit patterns, short-circuit connections, or render entire wafers defective. This heightened sensitivity to micro-contamination has made ultra-clean fluid streams not just a requirement, but a linchpin of production efficiency: tighter particle control directly translates to 15-30% higher yields, slashing billions in scrap costs annually.
LOONG’s filtration technologies are engineered to meet these microscopic battles head-on. Across key processes—from CMP slurry circulation to photoresist filtration, and acid/base etchant purification—our solutions target and remove particles, colloids, and chemical impurities at the nanoscale. Leveraging next-gen membrane materials (PTFE, PES) and ultra-high-purity manufacturing, we thrive in the harshest environments.
Our filtration solution is designed to minimize extractables and maintain flow integrity, ensuring fluids stay contaminant-free from storage to process tools. Consistent, repeatable cleanliness that safeguards your most advanced nodes—and your bottom line.
Effectively removes sub-micron particles and metal ions to eliminate defect sources on wafer surfaces, ensuring photoresists and developers meet extreme purity requirements for advanced nodes.
Exceptional Batch Consistency Reliable filtration eliminates batch-to-batch variation, maintaining critical parameters like viscosity and surface tension within spec to support high chip yield.
Reduced Cost of Ownership High-efficiency filtration minimizes waste of high-value chemicals while extending component service life and reducing downtime, optimizing overall operational costs.
Uninterrupted Supply Security Fully automated, high-flow filtration enables continuous production, preventing disruptions to lithography tool availability and ensuring reliable supply to fab operations.
Superior Planarization Assurance Precisely controls abrasive particle size distribution and removes agglomerated contaminants to prevent wafer scratching, ensuring high yield in chip planarization processes.
Absolute Contamination-Free Promise Effectively eliminates metal ions and organic impurities that could compromise device performance, meeting extreme purity standards for advanced nodes.
Excellent Batch-to-Batch Uniformity Consistent filtration maintains uniform chemical composition and particle concentration across batches, providing reliable process window repeatability for mass production.
Optimized Production Economics High-flow filtration enables continuous slurry production, reduces downtime, and minimizes raw material waste, enhancing overall capacity and profitability.
